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The optimization of electrical performance can be considered from the following aspects, namely the control of existing and upcoming thin films located on the contact coating surface. One of the main requirements for the electrical performance of a pin set is to establish and maintain a stable pin set impedance. To achieve this goal, a metal contact interface is needed to provide such inherent stability. Establishing such a contact interface requires the surface film to be able to avoid or split during contact fitting. These two different choices clarify the difference between precious or rare metals and ordinary metals.

To varying degrees, precious metal coatings (such as gold, palladium, and their alloys) are essentially free from surface films. For these coatings, the metal contact at the interface is relatively simple, as it only requires the movement of the accompanying substances on the contact surface during mating. This is usually easy to achieve. To maintain the stability of the contact interface impedance, the pin design requires attention to maintaining the precious metal properties of the contact surface to prevent external factors such as contaminants, diffusion of substrate metal, and contact wear.
Ordinary metal coatings, especially tin or tin alloys, are naturally covered with a layer of oxide film. The function of tin contact coating is that this oxide layer is easily damaged during coordination, making it easier to establish metal contact. The requirement for pin design is to ensure that the oxide film ruptures during pin fitting, while ensuring that the contact interface is no longer oxidized during the effective period of the electrical connector. Re oxidation corrosion is the main performance degradation mechanism of tin contact coatings in wear corrosion. Silver contact coating [sensitive term] is considered a common metal coating because it is susceptible to corrosion by sulfides and chlorides. Due to the formation of valve materials, nickel plating is usually considered as a common metal.